Heat-dissipation problem散热问题
heat compensator dissipation rate散热率
heat power dissipation热功耗
heat of dissipation耗散热
bidirectional heat-dissipation双向散热
heat compensator dissipation factor热消散系数
tunnel heat-dissipation area巷道散热面积
Cabinet heat-dissipation design箱体散热设计
ventilation and heat-dissipation structure通风散热结构
Flip-chip was also studied with this model. It was found that flip-chip may deteriorate the heat dissipation unless bonding area was deliberately arranged.
倒装芯片的研究发现,倒装芯片只有合理的设计键合区域才能改善芯片的散热性能。
It has weak dispersion, wide bandwidth but weak heat dissipation capability. So the increasing of output power is confined.
螺旋线行波管是目前应用最为普遍的行波管之一,它的特点是色散弱,工作频带宽,但热耗散能力差,使得输出功率的提高受到限制。
参考来源 - 有限厚度螺旋线慢波结构研究The power rating and the heat dissipation increases dramatically as the density of the electronic circuit on computer's processor increasing.
计算机芯片的集成度倍增,使得芯片功率和散热量增加。
参考来源 - 热管传热性能检测系统及其检测评估方法Temperature is the most important parameter of studying heat dissipation.
温度是研究热耗散的最重要的参量。
参考来源 - 疲劳过程中热效应机理的实验研究